Paschen curve approach to investigate electron density and deposition rate of Cu in magnetron sputtering system
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Date
2016
Journal Title
Journal ISSN
Volume Title
Publisher
Taylor and Francis Inc.
Abstract
In this work, Paschen curve for argon gas was obtained during copper deposition using a DC magnetron sputtering system. Five process parameters of Paschen curve were used to obtain the electron density and deposition rate of the deposited nanostructured thin films. Plasma parameter such as electron density was correlated with the deposition rate. It is observed that a minimum deposition rate was obtained for the plasma process parameter corresponding to the Paschen minimum. This investigation helps to understand and optimize the quality of nanostructured thin films depending on the process parameters. ? 2016 Informa UK Limited, trading as Taylor & Francis Group.
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Keywords
Argon, Carrier concentration, Deposition rates, Electron density measurement, Electrons, Magnetron sputtering, Thin films, Copper deposition, DC magnetron sputtering systems, Magnetron sputtering systems, Nanostructured thin film, Paschen curves, Paschen minimums, Plasma parameter, Process parameters, Deposition
Citation
Gopikishan, S., Banerjee, I., Bogle, K. A., Das, A. K., Pathak, A. P., & Mahapatra, S. K. (2016). Paschen curve approach to investigate electron density and deposition rate of Cu in magnetron sputtering system. Radiation Effects and Defects in Solids, 171(11-12), 999-1005. doi: 10.1080/10420150.2016.1267734