Axial distribution of plasma fluctuations, plasma parameters, deposition rate and grain size during copper deposition
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Date
2017
Journal Title
Journal ISSN
Volume Title
Publisher
Taylor and Francis Inc.
Abstract
Floating potential fluctuations, plasma parameters and deposition rate have been investigated as a function of axial distance during deposition of copper in direct current (DC) magnetron sputtering system. Fluctuations were analyzed using phase space, power spectra and amplitude bifurcation plots. It has been observed that the fluctuations are modified from chaotic to ordered state with increase in the axial distance from cathode. Plasma parameters such as electron density (ne), electron temperature (Te) and deposition rate (Dr) were measured and correlated with plasma fluctuations. It was found that more the deposition rate, greater the grain size, higher the electron density, higher the electron temperature and more chaotic the oscillations near the cathode. This observation could be helpful to the thin film technology industry to optimize the required film. ? 2017 Informa UK Limited, trading as Taylor & Francis Group.
Description
Keywords
Carrier concentration, Cathodes, Copper, Deposition, Deposition rates, Electrodes, Electron density measurement, Electrons, Grain size and shape, Phase space methods, Plasma devices, Power spectrum, Surface morphology, Axial distribution, Copper deposition, Direct current magnetron sputtering, Floating potentials, Fluctuation, Grain size, Plasma fluctuations, Thin-film technology, Electron temperature
Citation
Gopikishan, S., Banerjee, I., Pathak, A., & Mahapatra, S. K. (2017). Axial distribution of plasma fluctuations, plasma parameters, deposition rate and grain size during copper deposition. Radiation Effects and Defects in Solids, 172(7-8), 545-554. doi: 10.1080/10420150.2017.1359597