Axial distribution of plasma fluctuations, plasma parameters, deposition rate and grain size during copper deposition

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dc.contributor.authorGopikishan, S.
dc.contributor.authorBanerjee, I.
dc.contributor.authorPathak, Anand
dc.contributor.authorMahapatra, S. K.
dc.date.accessioned2018-03-09T06:40:21Z
dc.date.accessioned2024-08-13T12:45:38Z
dc.date.available2018-03-09T06:40:21Z
dc.date.available2024-08-13T12:45:38Z
dc.date.issued2017
dc.description.abstractFloating potential fluctuations, plasma parameters and deposition rate have been investigated as a function of axial distance during deposition of copper in direct current (DC) magnetron sputtering system. Fluctuations were analyzed using phase space, power spectra and amplitude bifurcation plots. It has been observed that the fluctuations are modified from chaotic to ordered state with increase in the axial distance from cathode. Plasma parameters such as electron density (ne), electron temperature (Te) and deposition rate (Dr) were measured and correlated with plasma fluctuations. It was found that more the deposition rate, greater the grain size, higher the electron density, higher the electron temperature and more chaotic the oscillations near the cathode. This observation could be helpful to the thin film technology industry to optimize the required film. ? 2017 Informa UK Limited, trading as Taylor & Francis Group.en_US
dc.identifier.citationGopikishan, S., Banerjee, I., Pathak, A., & Mahapatra, S. K. (2017). Axial distribution of plasma fluctuations, plasma parameters, deposition rate and grain size during copper deposition. Radiation Effects and Defects in Solids, 172(7-8), 545-554. doi: 10.1080/10420150.2017.1359597en_US
dc.identifier.doi10.1080/10420150.2017.1359597
dc.identifier.issn10420150
dc.identifier.urihttps://kr.cup.edu.in/handle/32116/648
dc.identifier.urlhttps://www.tandfonline.com/doi/full/10.1080/10420150.2017.1359597
dc.language.isoen_USen_US
dc.publisherTaylor and Francis Inc.en_US
dc.subjectCarrier concentrationen_US
dc.subjectCathodesen_US
dc.subjectCopperen_US
dc.subjectDepositionen_US
dc.subjectDeposition ratesen_US
dc.subjectElectrodesen_US
dc.subjectElectron density measurementen_US
dc.subjectElectronsen_US
dc.subjectGrain size and shapeen_US
dc.subjectPhase space methodsen_US
dc.subjectPlasma devicesen_US
dc.subjectPower spectrumen_US
dc.subjectSurface morphologyen_US
dc.subjectAxial distributionen_US
dc.subjectCopper depositionen_US
dc.subjectDirect current magnetron sputteringen_US
dc.subjectFloating potentialsen_US
dc.subjectFluctuationen_US
dc.subjectGrain sizeen_US
dc.subjectPlasma fluctuationsen_US
dc.subjectThin-film technologyen_US
dc.subjectElectron temperatureen_US
dc.titleAxial distribution of plasma fluctuations, plasma parameters, deposition rate and grain size during copper depositionen_US
dc.title.journalRadiation Effects and Defects in Solids
dc.typeArticleen_US

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